PKFC24C
DESCRIPTION
The PKFCxx C series encapsulated flip chips employ advanced silicon P/N junction technology for unmatched board-level transient voltage protection against Electrostatic Discharge (ESD) and Electrical Fast Transients (EFT). Developed specifically for high-density circuit protection, this series meets the IEC 61000-4-2 and 61000-4-4 requirements. These devices are ideally suited for handheld devices, PCMCIA and SMART cards. This series provides ESD protection greater than 25 kilovolts with a peak pulse power dissipation of 250 Watts per line for an 8/20µs waveform. In addition, the PKFCxx C series features superior clamping performance, low leakage current characteristics and a response time of less than a nanosecond. Their low inductance virtually eliminates overshoot voltage due to package inductance.
FEATURES
- patible with IEC 61000-4-2 (ESD): Air 15k V, Contact 8k V
- patible with IEC 61000-4-4 (EFT): 40A, 5/50ns
- Chip Scale Package 0.050” x 0.030”
- ESD Protection >...
