Datasheet Details
| Part number | SUF-1000 |
|---|---|
| Manufacturer | RF Micro Devices |
| File Size | 736.51 KB |
| Description | Cascadable pHEMT MMIC Amplifier |
| Datasheet |
 SUF-1000 Datasheet
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| Part number | SUF-1000 |
|---|---|
| Manufacturer | RF Micro Devices |
| File Size | 736.51 KB |
| Description | Cascadable pHEMT MMIC Amplifier |
| Datasheet |
SUF-1000 Datasheet
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(Dimensions in inches [millimeters]) Notes: 1. 2. 3. 4. 5. 6. No connection required for unlabeled bond pads Die thickness is 0.004 [0.10] Typical bond pad is 0.004 [0.10] square Backside metallization: Gold Backside is ground Bond pad metallization: Gold Pin Names and Descriptions Pin Name Description 1 RFIN This pad is DC coupled and matched to 50Ω.An external DC block is required.2 RFOUT/BIAS This pad is DC coupled and matched to 50Ω.Bias is applied through this pad.Die Bottom
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