1) Ultra small mold type. (VMN2) 2) Low high frequency resistance and lowcapacitance
zConstruction Silicon epitaxial planer
zTaping dimensions (Unit : mm)
VMN2
zStructure
zAbsolute maximum ratings (Ta=25°C)
Parameter
Symbol
Reverse voltage(DC) Forward current Junction temperature
VR IF Tj
Storage temperature
Tstg
Limits 30 100 150
-55 to +150
Unit V mA °C °C
zElectrical characteristics (Ta=25°C)
Parameter
Symbol Min. Typ. Max. Forward voltage Reverse current Capacitance between t.
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PIN diode
RN242CS
zApplications High frequency switching
zDimensions (Unit : mm)
zLead size figure (Unit : mm)
0.55
0.45 0.45 0.5
zFeatures 1) Ultra small mold type. (VMN2) 2) Low high frequency resistance and lowcapacitance
zConstruction Silicon epitaxial planer
zTaping dimensions (Unit : mm)
VMN2
zStructure
zAbsolute maximum ratings (Ta=25°C)
Parameter
Symbol
Reverse voltage(DC) Forward current Junction temperature
VR IF Tj
Storage temperature
Tstg
Limits 30 100 150
-55 to +150
Unit V mA °C °C
zElectrical characteristics (Ta=25°C)
Parameter
Symbol Min. Typ. Max.
Forward voltage Reverse current Capacitance between terminals
VF - - 1 IR - - 0.1 Ct - - 0.35
High frequency resistance
Rf - - 3 - - 1.
RN242CS Datasheet
