Rectron Semiconductor GLZ10A
SURFACE MOUNT ZENER DIODES
FEATURES
● Planar Die construction● 500mW Power Dissipation
● Ideally Suited for Automated Assembly Processes
● In compliance with EU RoHS 2002/95/EC directives
MECHANICAL DATA
● Case: Molded Glass MINI-MELF● Terminals: Solderable per MIL-STD-750, Method 2026
● Approx. Weight: 0.001 ounces, 0.03 grams.
● Mounting Position: Any
● Polarity : Color band denotes cathode end
● Packing information T/R - 2.5K per 7" plastic Reel T/R - 10K per 13" plastic Reel MINI - MELF / LL34 0.063(1.6) 0.055(1.4)DIA. 0.020(0.5) 0.012(0.3) 0.146(3.7) 0.130(3.3) 0.020(0.5) 0.012(0.3) Dimensions in inches and (millimeters)
MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS
Parameter Symbol Power Dissipation at TA= 25OC P TOT Junction Temperature Range TJ Storage Temperature Range TSTG Valid provided that leads at a distance of 10mm from case are kept at ambient temperature. Value 500 -55 to + 175