GLZ18C Datasheet | Rectron

FEATURES - Planar Die construction - 500m W Power Dissipation - Ideally Suited for Automated Assembly Processes - In pliance with EU Ro HS 2002/95/EC directives MECHANICAL DATA - Case: Molded Glass MINI-MELF - Terminals: Solderable per MIL-STD-750, Method 2026 - Approx. Weight: 0.001 ounces, 0.03 grams. - Mounting Position: Any - Polarity : Color band denotes cathode end - Packing information T/R - 2.5K per 7" plastic Reel T/R - 10K per 13" plastic Reel MINI - MELF / LL34 0.063(1.6) 0.055(1.4)DIA. 0.020(0.5) 0.012(0.3) 0.146(3.7) 0.130(3.3) 0.020(0.5) 0.012(0.3) Dimensions in inches and (millimeters) MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS Parameter Symbol Power Dissipation at TA= 25OC P TOT Junction Temperature Range Storage Temperature Range TSTG Valid provided that leads at a distance of 10mm from case are kept at ambient temperature. Value 500 -55 to +...