Rectron Semiconductor MM1Z5237B
SURFACE MOUNT ZENER DIODE
FEATURES
* Planar Die Construction * 500mW Power Dissipation * General Purpose, Medium Current * Ldeally Suited for Automated Assembly ProcessesMECHANICAL DATA
* Case: Molded plastic * Epoxy: UL 94V-O rate flame retardant * Lead: MIL-STD-202E method 208C guaranteed * Mounting position: Any * Weight: 0.01 gram .026(.65) .018(.45) SOD-123 .110(2.80) .102(2.60) .152(3.85) .140(3.55) .067(1.70) .059(1.50) .006(.15) .003(.08)MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS
Ratings at 25 oC ambient temperature unless otherwise specified. REF .020(0.50) .049(1.25) .041(1.05) .004(0.10) .000(0.00) MAXIMUM RATINGES ( @ TA = 25oC unless otherwise noted ) RATINGS Max. Steady State Power Dissipation @TA=25oC (Note 1) Max. Operating Temperature Range Storage Temperature Range SYMBOL PD TJ TSTG Dimensions in inches and (millimeters) VALUE 500 -65 to +150 -65 to +150 UNITS mW oC oCELECTRICAL CHARACTERISTICS
( @ TA = 25oC unless otherwise noted ) CHARACTERISTICS SYMBOL MIN. Thermal Resistance Junction to Ambient (Note 1) R θJA - Max.