HVC190
Features
- Low capacitance. (C = 0.35 p F max)
- Low forward resistance. (rf = 3.0 Ω typ)
- Ultra small Flat Lead Package (UFP) is suitable for surface mount design.
Ordering Information
Type No. HVC190 Laser Mark H9 Package Code UFP
Pin Arrangement
Cathode mark Mark 1
H9
2 1. Cathode 2. Anode
Rev.1.00 Dec 22, 2004 page 1 of 4
Absolute Maximum Ratings
(Ta = 25°C)
Item Reverse voltage Forward current Power dissipation Junction temperature Storage temperature Symbol VR IF Pd Tj Tstg Value 50 50 150 125
- 55 to +125 Unit V m A m W °C °C
Electrical Characteristics
(Ta = 25°C)
Item Forward voltage Reverse current Capacitance Forward resistance 1 ESD-Capability
- Note: Symbol VF IR C rf Min
- -
- - 200 Typ
- -
- 3.0 Max 1.0 100 0.35 5.0 Unit V n A p F Ω V Test Condition IF = 50 m A VR = 50 V VR = 50 V, f = 1 MHz IF = 10 m A, f = 100 MHz C = 200 p F, Both forward and reverse direction 1 pulse
1. Failure criterion ; IR ≥ 200 n A at VR = 50 V
Rev.1.00 Dec 22, 2004 page 2 of...
