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M6MGD137W34DWG - CMOS FLASH MEMORY

General Description

The M6MGD137W34DWG is a Stacked Chip Scale Package (S-CSP) that contents 128M-bit Flash memory and 32M-bit Mobile RAM in a 72-pin Stacked CSP for lead free use.

Key Features

  • Access Time Flash Mobile RAM Supply Voltage Ambient Temperature Package 70ns (Max. ) 80ns (Max. ) FM-VCC=2.7 ~ 3.0V Ta= -40 ~ 85 degree 72pin S-CSP, Ball pitch 0.80mm Outer-ball:Su-Ag-Cu.

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www.DataSheet4U.com Renesas LSIs RENESAS CONFIDENTIAL M6MGD137W34DWG Stacked-CSP ( Chip Scale Package) 134,217,728-BIT (8,388,608-WORD BY 16-BIT) CMOS FLASH MEMORY & 33,554,432-BIT (2,097,152-WORD BY 16-BIT) CMOS MOBILE RAM Description The M6MGD137W34DWG is a Stacked Chip Scale Package (S-CSP) that contents 128M-bit Flash memory and 32M-bit Mobile RAM in a 72-pin Stacked CSP for lead free use. 128M-bit Flash memory is a 8,388,608 words, single power supply and high performance non-volatile memory fabricated by CMOS technology for the peripheral circuit and DINOR IV (Divided bit-line NOR IV) architecture for the memory cell. All memory blocks are locked and can not be programmed or erased, when F-WP# is Low.