Renesas Electronics HSM2836C
Silicon Diode
FEATURES
● Fast recovery time.● MPAK package is suitable for high density surface mounting and high speed assembly. Ordering Information Type No. HSM2836C Laser Mark A4 Package Name MPAK Package Code (Previous Code) PLSP0003ZC-A (MPAK) Pin Arrangement 3 2 1 (Top View) 1. Cathode 2. Cathode 3. Anode Rev.4.00 Mar 10, 2005 page 1 of 4 HSM2836C
ABSOLUTE MAXIMUM RATINGS
*1 (Ta = 25°C) Item Peak reverse voltage Reverse voltage Peak forward current Non-Repetitive peak forward surge current Average rectified current Junction temperature Storage temperature Notes: 1. Per one device. 2. Within 1 µs forward surge current. Symbol VRM VR IFM IFSM * IO Tj Tstg 2 Value 85 80 300 4 100 125 −55 to +125 Unit V V mA A mA °C °CELECTRICAL CHARACTERISTICS
*1 (Ta = 25°C) Item Forward voltage Symbol VF1 VF2 VF3 IR C trr Min — — — — — — Typ 0.72 0.83 0.90 — 2.5 — Max 1.0 1.0 1.2 0.1 4.0 20 Unit V Test Condition IF = 10 mA IF = 50 mA IF = 100 mA VR = 80 V VR = 0 V, f = 1 MHz IF = 10 mA, VR = 6 V, RL = 50 Ω Reverse current Capacitance Reverse recovery time Note: µA pF ns 1.