RD33FM Overview
Description
These products are zener diodes with an allowable power dissipation of 1 W and a planar type 2 pin power mini mold package. PACKAGE DIMENSION (Unit: mm) 4.7 ±0.3 4.3 ±0.1 <R> FEATURES - Suitable for high-density mounting because the mounting area is reduced to about 65% compared with that of the 3pin power mini mold RD**P, which has been conventionally used until now.
Key Features
- Achieves flat-surface mounting with a two-pin structure, while having the same Zener voltage classification as that for RD**Ps
