11577-11 Description
INTRODUCTION This report describes a petitive analysis of the Rockwell 11577-11 digital correlator. One device packaged in a 144-pin Square Quad Flat Package (SQFP) was received for the analysis. The device was taken from a GPS receiver chipset manufactured by IST.
11577-11 Key Features
- Titanium silicided diffusion structures
- Device was encapsulated in a 144-pin plastic Square Quad Flat Package (SQFP)
- Copper (Cu) leadframe was internally plated with silver (Ag)
- External pins were tinned with tin-lead (SnPb) solder
- Lead-locking provisions (holes) at all pins
- Thermosonic ball bonding using 1.1 mil O.D. gold wire
- Pins 139
- 143 were not connected
- Sawn dicing (full-depth)
- Silver-filled epoxy die attach. Die Process