ROHM Semiconductor DAN217FH
Switching Diode
APPLICATIONS
Ultra high speed switching●Dimensions (Unit : mm) Data Sheet AEC-Q101 Qualified
●Land size figure (Unit : mm) 1.9 0.3~0.6 1.0MIN. 2.4
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FEATURES
1) Small mold type. (SMD3) 2) High reliability.●Construction Silicon epitaxial planar 2.9±0.2 各リードとも 0.4 +-00..105 Eac同h寸le法ad has same dimension (3) +0.1 0.15-0.06 2.8±0.2 1.6-+00..12 (2) 0.95 0.95 1.9±0.2 (1) 0~0.1 0.8±0.1 1.1±0.2 0.01 ROHM : SMD3 JEDEC :S0T-346 JEITA : SC-59 weekcode
●Taping specifications (Unit : mm) 4.0±0.1 2.0±0.05 φ1.5±0.1 0 0.95 0.8MIN. SMD3
●Structure 0.3±0.1 1.75±0.1 3.2±0.1 5.5±0.2 3.5±0.05 8.0±0.2 3.2±0.1 0~0.5 3.2±0.1 4.0±0.1
●Absolute maximum ratings (Ta=25°C) Parameter Symbol Reverse voltage (repetitive peak) Reverse voltage (DC) Forward current (Single) VRM VR IFM Average rectified forward current (Single) Io Surge current (t=1us) Power dissipation Isurge Pd Junction temperature Tj Storage temperature Tstg Limits 80 80 300 100 4 200 150 55 to 150 φ1.05MIN Unit V V mA mA A mW °C °C 1.35±0.1
●Electrical characteristics (Ta=25°C) Parameter Symbol Min.