63CNQ100 Datasheet | SANGDEST MICROELECTRONICS

Features : - 175℃ TJ operation - Center tap module - Very Low forward voltage drop - High purity, high temperature epoxy encapsulation for enhanced mechanical strength and moisture resistance - High frequency operation - Guard ring for enhanced ruggedness and long term reliability - Low profile, high current package - This is a Pb - Free Device - All SMC parts are traceable to the wafer lot - Additional testing can be offered upon request 63CNQ… Case Styles 63CNQ…SL 63CNQ…SM PRM3 PRM3-SL PRM3-SM Mechanical Dimensions: In Inches / mm PRM3 - Weiqi Street, Airport Development Zone, Jiangning District, Nanjing, China 211113 (86) 25-87123907 - - FAX (86) 25-87123900 - World Wide Web Site - http://.sangdest..cn - E-Mail Address - sales@ sangdest..cn - SANGDEST MICROELECTRONICS Technical Data Data Sheet N1054, Rev. - 63CNQ SERIES Green Products PRM3-SL PRM3-SM MARKING, MOLDING RESIN Marking for 63CNQ080/SL/SM, 1st row SS YYWWL, 2nd row 63CNQ080/SL/SM, 3rd row 1 2 3 (pin) Where YY is the manufacture year WW is the manufacture week code L is the wafer’s Lot Number Molding resin Epoxy resin UL: 94V-0 - Weiqi Street, Airport Development Zone, Jiangning District, Nanjing, China 211113 (86) 25-87123907 - - FAX (86) 25-87123900 - World Wide Web Site - http://.sangdest..cn...