ER2D Datasheet | SANGDEST MICROELECTRONICS

Features : - Glass Passivated Die Construction - Ideally Suited for Automatic Assembly - Low Forward Overload Drop, High Efficiency - Surge Overload Rating to 30A Peak - Low Power Loss - Super-Fast Recovery Time - Plastic Case Material has UL Flammability Classification Rating 94V-O - This is a Pb - Free Device - All SMC parts are traceable to the wafer lot - Additional testing can be offered upon request Mechanical Data: - Case: Low Profile Molded Plastic - Terminals: Solder Plated, Solderable per MIL-STD-750, Method 2026 - Polarity: Cathode Band or Cathode Notch - Marking: Type Number - Weight: 0.68 grams(approx) Mechanical Dimensions: In mm / Inches ER2A MARKING, MOLDING RESIN Marking for ER2A/B/C/D/E/G/J, 1st row ER2A/B/C/D/E/G/J, 2nd row YYWWL Where YY is the manufacture year WW is the manufacture week code L is the wafer’s Lot Number - Weiqi Street, Airport Development Zone, Jiangning District, Nanjing, China 211113 (86) 25-87123907 - - FAX (86) 25-87123900 - World Wide Web Site - http://.sangdest..cn - E-Mail Address - sales@ sangdest..cn - SANGDEST MICROELECTRONICS Technical Data Data Sheet N0132, Rev. D ER2A-ER2J 2.0A SURFACE MOUNT SUPER FAST RECTIFIER Green Products Ordering Information: Device ER2A-ER2J Package SMB...