MBRF2080CTL
Features
:
- 150 ℃ TJ operation
- Center tap configuration
- Low forward voltage drop
- High purity, high temperature epoxy encapsulation for enhanced mechanical strength and moisture resistance
- High frequency operation
- Guard ring for enhanced ruggedness and long term reliability
- Terminals: pure tin plated, solderable per MIL-STD-750, Method 2026
- This is a Pb
- Free Device
- All SMC parts are traceable to the wafer lot
- Additional testing can be offered upon request
OUTLINE DRAWING
Mechanical Dimensions: In mm
SYMBOL
A A1 A2 A3 b b1 b2 b3 b4 c D E e e1 H1 L L1 L2 L3 ΦP1(上口) ΦP2(下口) Q Θ1 Θ2 Θ3 Θ4 Θ5
MIN. 4.30 1.10 2.80 2.50 0.50 1.10 1.50 1.20 1.60 0.55 14.80 9.96
6.50 12.70 1.60 0.80 0.60 3.30 2.99 2.50
TYP.
4.50 1.30 3.00...
