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SK15GH066 - IGBT

Key Features

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  • Compact design.
  • One screw mounting module.
  • Heat transfer and insulation through direct copper bonded aluminium oxide ceramic (DBC).
  • 600V Trench IGBT3 technology.
  • 600V CAL IHD diode technology.
  • Integrated NTC temperature sensor.
  • UL recognized, file no. E 63 532 Typical.

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Full PDF Text Transcription (Reference)

The following content is an automatically extracted verbatim text from the original manufacturer datasheet and is provided for reference purposes only.

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SK 15 GH 066 SEMITOP® 2 IGBT module SK 15 GH 066 Features* • Compact design • One screw mounting module • Heat transfer and insulation through direct copper bonded aluminium oxide ceramic (DBC) • 600V Trench IGBT3 technology • 600V CAL IHD diode technology • Integrated NTC temperature sensor • UL recognized, file no.