EClamp2340C Datasheet PDF | Semtech Corporation

Semtech Corporation EClamp2340C

The EClamp2340C has solder bumps located in a 5 x 5 matrix layout on the active side of the device. The bumps are designated by the numbers 1 - 5 along the horizontal axis and letters A - E along the vertical axis. The input of the lines to be protected are connected at bumps A1 - A5 and B1 - B5.

Part No.	EClamp2340C
Datasheet	EClamp2340C Download
Manufacturer	Semtech Corporation
Description	Emi Filter And Esd Protection
Buy	Stock & Price

FEATURES

Flip Chip bidirectional EMI/RFI filter with integrated ESD protection ESD protection to IEC 61000-4-2 (ESD) Level4, +/-15kV (air), +/-8kV (contact) EClamp2340C PROTECTION PRODUCTS - EMIClampTM

DESCRIPTION

The EClampTM2340C is a low pass filter array with integrated TVS diodes. It is designed to suppress unwanted EMI/RFI signals and provide electrostatic discharge (ESD) protection in portable electronic equipment. This state-of-the-art device utilizes solidstate silicon-avalanche technology for superior clamping performance and DC electrical characteristics. They have been optimized for protection of color LCD panels in cellular phones and other portable electronics. The device consists of ten identical circuits comprised of TVS diodes for ESD protection, and a resistor capacitor network for EMI/RFI filtering. A series resistor value of 100Ω and a capacitance value of 18pF is used to achieve 20dB minimum attenuation from 800MHz to 3GHz. Each line features two stages of TVS diode protection.