P4SMAFJ78A
Key Features
- For surface mounted applications in order to optimize board space.
- Low profile package
- Glass passivated junction
- Low inductance
- Plastic package has Underwriters Laboratory Flammability Mechanical Data
- Case: SMAF
- Terminals: Solderable per MIL-STD-750, Method 2026 SMAF
- 4 4.9 3.3 3.7
- 40 2.80
- 3 1.6
