P4SMAFJ8.0A Datasheet | SEMTECH

Features - For surface mounted applications in order to optimize board space. - Low profile package - Glass passivated junction - Low inductance - Plastic package has Underwriters Laboratory Flammability Mechanical Data - Case: SMAF - Terminals: Solderable per MIL-STD-750, Method 2026 SMAF 4.4 4.9 3.3 3.7 2.40 2.80 1.3 1.6 0.9 1.1 0.12 0.2 All Dimensions in mm Absolute Maximum Ratings (Ta = 25 OC unless otherwise specified) Parameter Symbol Peak Pulse Power Dissipation on 10/1000 s waveform 1) 2) 4) Peak Forward Surge Current, 8.3 ms Single Half Sine-wave Superimposed on Rated Load (JEDEC Method) 3) PPPM IFSM Peak Pulse Current on 10/1000 us waveform 1) Typical Junction capacitance at VR=4V, f=1MHz IPPM ESD Voltage per IEC6100-4-2 Air Contact VESD1 VESD2 Value 400 40 see Table 1 ± 30 ±...