Description
PC123XNNSZ0F Series contains an IRED optically coupled to a phototransistor.
It is packaged in a 4-pin DIP, available in wide-lead spacing option and SMT gullwing lead-form option.
Input-output isolation voltage(rms) is 5kV.
Features
- s
1. 4-pin DIP package 2. Double transfer mold package (Ideal for Flow Solder-
ing) 3. Current transfer ratio (CTR : MIN. 50% at IF=5 mA,
VCE=5V) 4. Several CTR ranks available 5. Reinforced insulation type (Isolation distance : MIN. 0.4mm) 6. Long creepage distance type (wide lead-form type
only : MIN. 8mm) 7. High isolation voltage between input and output
(Viso(rms) : 5kV) 8. RoHS directive compliant.
- Agency approvals/Compliance
1. Recognized by UL1577 (Double protection isolation), file.
PC123X1NFZ0F Datasheet
