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PC123XNYIP0F - Photocoupler

Download the PC123XNYIP0F datasheet PDF. This datasheet also includes the PC123XNNSZ0F variant, as both parts are published together in a single manufacturer document.

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Note: The manufacturer provides a single datasheet file (PC123XNNSZ0F-SHARP.pdf) that lists specifications for multiple related part numbers.

General Description

PC123XNNSZ0F Series contains an IRED optically coupled to a phototransistor.

It is packaged in a 4-pin DIP, available in wide-lead spacing option and SMT gullwing lead-form option.

Input-output isolation voltage(rms) is 5kV.

Overview

PC123XNNSZ0F Series PC123XNNSZ0F DIP 4pin Reinforced Insulation Type Photocoupler Series.

Key Features

  • s 1. 4-pin DIP package 2. Double transfer mold package (Ideal for Flow Solder- ing) 3. Current transfer ratio (CTR : MIN. 50% at IF=5 mA, VCE=5V) 4. Several CTR ranks available 5. Reinforced insulation type (Isolation distance : MIN. 0.4mm) 6. Long creepage distance type (wide lead-form type only : MIN. 8mm) 7. High isolation voltage between input and output (Viso(rms) : 5kV) 8. RoHS directive compliant.
  • Agency approvals/Compliance 1. Recognized by UL1577 (Double protection isolation), file.

More Datasheets from Sharp Corporation

Part Number Description
PC123XNYFZ0F Photocoupler
PC123XNYSZ0F Photocoupler
PC123XNYUP0F Photocoupler
PC123XNNFZ0F Photocoupler
PC123XNNSZ0F Photocoupler
PC123XNNUP0F Photocoupler
PC123X1NFZ0F Photocoupler
PC123X1NSZ0F Photocoupler
PC123X1NUP0F Photocoupler
PC123X1YFZ0F Photocoupler