ES1G Overview
Key Specifications
Package: SMA
Mount Type: Surface Mount
Pins: 2
Height: 2.5 mm
Key Features
- Glass Passivated Die Construction
- Ideally Suited for Automatic Assembly
- Low Forward Overload Drop, High Efficiency
- Low Power Loss
- Super-Fast Recovery Time
- Plastic Case Material has UL Flammability Classification Rating 94V-O
- This is a Pb
- All SMC parts are traceable to the wafer lot
- Additional testing can be offered upon request
- Circuit Diagram Mechanical Data
