TSMB510CA Datasheet PDF

FEATURES

●表面安装应用 For surface mount applications
●玻璃钝化芯片 Glass passivated junction
●快速响应时间 Very fast response time
●优良钳位能力 Excellent clamping capability
●最高焊接温度 260℃/10 秒 High temperature soldering guaranteed: 260°C/10 seconds at terminals
●600W 峰值脉冲保护能力 600W peak pulse power capability
●10/1000s 波形, 重复率:0.01% a 10/1000s waveform, repetition rate (duty cycle): 0.01%
● 引线和管体皆符合 RoHS 标准。 Lead and body according with RoHS standard 机械数据

MECHANICAL DATA

●封装: 塑料封装 Case: Molded plastic body
●端子: 焊料被镀 Terminals: Solder plated
●极性: 色环端为负极 Polarity: Color band denotes cathode end
●安装位置: 任意 Mounting Position: An