SPANSION AM70PDLI29BDH
Stacked Multi-Chip Package (MCP/XIP) Flash Memory
| Part No. | AM70PDLI29BDH |
|---|---|
| Datasheet | AM70PDLI29BDH Download |
| Manufacturer |  SPANSION |
| Description | Stacked Multi-Chip Package (MCP/XIP) Flash Memory |
| Buy | Stock & Price |
FEATURES
● Consists of Am29PDL127H/Am29PDL129H, 32 Mb pSRAM and two Am29LV640M.● Power supply voltage of 2.7 to 3.3 volt
● High performance (XIP) — Access time as fast as 65 ns initial / 25 ns page
● SecSiTM (Secured Silicon) Sector region — Up to 128 words accessible through a command sequence — Up to 64 factory-locked words — Up to 64 customer-lockable words
● Both top and bottom boot blocks in one device
● Manufactured on 0.13 µm process technology
● 20-year data retention at 125°C
● Minimum 1 million erase cycle guarantee per sector
● High performance (Data Storage) — Access time as fast as 110 ns initial / 30 ns page
● Package — 93-Ball FBGA
● Operating Temperature — –40°C to +85°C PERFORMANCE CHARACTERISTICS
● High Performance — Page access times as fast as 25 ns — Random access times as fast as 65 ns Flash Memory
FEATURES
(XIP) AM29PDL127H/AM29PDL129H ARCHITECTURAL ADVANTAGES● 128 Mbit Page Mode device — Page size of 8 words: Fast page read access from random locations within...
