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S71NS-J Datasheet Stacked Multi-Chip Product (MCP)

Manufacturer: Spansion (now Infineon)

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General Description

s of Spansion data sheet designations are presented here to highlight their presence and definitions.

Advance Information The Advance Information designation indicates that Spansion Inc.

is developing one or more specific products, but has not committed any design to production.

Overview

www.DataSheet4U.com S71NS-J Stacked Multi-Chip Product (MCP) 110 nm CMOS 1.8 Volt-only Simultaneous Read/Write, Burst Mode Multiplexed Flash Memory with pSRAM S71NS-J Cover Sheet Data Sheet (Advance Information) Notice to Readers: This document states the current technical specifications regarding the Spansion product(s) described herein.

Each product described herein may be designated as Advance Information, Preliminary, or Full Production.

See Notice On Data Sheet Designations for definitions.

Key Features

  • Single 1.8 volt read, program and erase (1.7 to 1.95 V).
  • Multiplexed Data and Address for reduced I/O count.
  • A15.
  • A0 multiplexed as DQ15.
  • DQ0.
  • Addresses are latched by AVD# control input when CE# low.
  • Simultaneous Read/Write operation.
  • Data can be continuously read from one bank while executing erase/program functions in other bank.
  • Zero latency between read and write operations.
  • Package.
  • 56-ball Ve.

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