SST32HF1622C Overview
The SST32HFx2/x2C boMemory devices integrate a CMOS flash memory bank with a CMOS SRAM memory bank in a Multi-Chip Package (MCP), manufactured with SST’s proprietary, high performance SuperFlash technology. The SST32HF16x2/32x2 devices use a PseudoSRAM. The SST32HF16x2C/3242C devices use standard SRAM.
SST32HF1622C Key Features
- boMemories organized as
- SST32HF1622C: 1M x16 Flash + 128K x16 SRAM
- SST32HF1642x: 1M x16 Flash + 256K x16 SRAM
- SST32HF1682: 1M x16 Flash + 512K x16 SRAM
- SST32HF3242x: 2M x16 Flash + 256K x16 SRAM
- SST32HF3282: 2M x16 Flash + 512K x16 SRAM
- Single 2.7-3.3V Read and Write Operations
- Concurrent Operation
- Read from or Write to SRAM while Erase/Program Flash
- Superior Reliability