BTW67 Datasheet | STMicroelectronics

Features - High current SCR - High mutation capability - Low thermal resistance with clip bonding - Insulated package RD91 high power: - Low thermal resistance with clip bonding - Insulated voltage: 2500 VRMS - plies with UL 1557 (File ref : E81734) - Ro HS (2002/95/EC) pliant Applications - Solid state relays - Welding equipment - High power motor control Description Available in 2500 V insulated high power package, the 50 A and 1000 V SCR BTW67 is suitable in applications where power handling and power dissipation are critical, such as solid state relays, welding equipment and high power motor control. Based on a clip assembly technology, they offer a superior performance in surge current handling capabilities. DS0642 - Rev 8 - July 2024 For further information contact your local STMicroelectronics sales office. .st. Characteristics Characteristics Symbol IT(RMS) IT(AV) ITSM I2t dl/dt IGM PG(AV) Tstg Tj VGRM Vins Table 1. Absolute maximum ratings Parameters RMS on-state current (full sine wave) Average on-state current (180° conduction angle) Non repetitive surge peak on-state current (full cycle, Tj initial = 25 °C) I2t value for fusing Critical rate of rise of on-state current IG = 2 x IGT , tr ≤ 100 ns F = 60 Hz Peak gate current tp = 20 µs Average gate power dissipation Storage junction temperature range Operating junction temperature range Tc = 70 °C Tc = 70 °C tp = 8.3 ms tp = 10 ms Tj = 125 °C Tj = 125 °C Tj = 125...