Datasheet4U Logo Datasheet4U.com

EMIF03-SIM03F3 - EMI filter including ESD protection

General Description

The EMIF03-SIM03F3 chip is a very low capacitance EMI filter designed to suppress EMI/RFI noise in all systems subjected to electromagnetic interference.

This filter includes ESD protection circuitry, which prevents damage to the protected device when subjected to ESD surges up to 15 kV.

Key Features

  • EMI symmetrical (I/O) low-pass filter High efficiency in EMI/ESD protection Lead-free package Very thin package High reliability offered by monolithic integration High reduction of parasitic elements through integration and wafer level packaging Figure 1. Lead-free Flip-Chip package (8 bumps) Complies with the following standards.
  • Pin configuration (bump side) 3 RST in 2 RST ext 1 A IEC 61000-4-2 level 4.
  • ± 15 kV (air discharge).
  • ±.

📥 Download Datasheet

📁 Similar Datasheet

Part Number Description Manufacturer
EMIF03-SIM02M8 EMI filter STMicroelectronics
EMIF01-100 EMI FILTER/TVS ARRAY Protek Devices
EMIF01-10005W5 EMI FILTER STMicroelectronics
EMIF01-10018W5 EMI FILTER STMicroelectronics
EMIF01-150 EMI FILTER/TVS ARRAY Protek Devices

Other Datasheets by STMicroelectronics

Part Number Description
EMIF03-SIM01 003 LINES EMI FILTER INCLUDING ESD PROTECTION
EMIF03-SIM01F2 3 LINES EMI FILTER INCLUDING ESD PROTECTION
EMIF03-SIM02F2 3 LINE EMI FILTER
EMIF03-SIM02F3 3 LINE EMI FILTER
EMIF03-SIM04F3 EMI filter including ESD protection

Full PDF Text Transcription (Reference)

The following content is an automatically extracted verbatim text from the original manufacturer datasheet and is provided for reference purposes only.

View original datasheet text
www.DataSheet4U.com EMIF03-SIM03F3 3-line IPAD™, EMI filter including ESD protection Features ■ ■ ■ ■ ■ ■ EMI symmetrical (I/O) low-pass filter High efficiency in EMI/ESD protection Lead-free package Very thin package High reliability offered by monolithic integration High reduction of parasitic elements through integration and wafer level packaging Figure 1. Lead-free Flip-Chip package (8 bumps) Complies with the following standards ■ Pin configuration (bump side) 3 RST in 2 RST ext 1 A IEC 61000-4-2 level 4 – ± 15 kV (air discharge) – ± 8 kV (contact discharge) IEC 61000-4-2 level 1 – ± 2 kV (air discharge) – ± 2 kV (contact discharge) ETSI 102.