EMIF06-HMC01F2 Datasheet | STMicroelectronics

DESCRIPTION The EMIF06-HMC01F2 is a highly integrated array designed to suppress EMI / RFI noise for High Speed Multi Media Card™ port filtering. The EMIF06-HMC01F2 Flip-Chip packaging means the package size is equal to the die size. Additionally, this filter includes an ESD protection circuitry which prevents the protected device from destruction when subjected to ESD surges up to 15 k V. BENEFITS - 6 lines low-pass-filter - High efficiency in EMI filtering - Very low PCB space consuming: < 4.4 mm2 - Lead Free package - Very thin package: 0.65 mm - High efficiency in ESD suppression - High reliability offered by monolithic integration - High reducing of parasitic elements through integration & wafer level packaging PLIES WITH THE FOLLOWING STANDARDS: IEC61000-4-2 Level 4 on external pins15k V (air discharge) 8k V (contact discharge) MIL STD 883E - Method 3015-6 Class 3 Figure 2: Configuration R10 R11 R12 R13 R14 Vmmc MMCclk MMCcmd MMCdat0 MMCdat1 MMCdat2 MMCdat3 Vmmc R2 R3 R4 R5 R6 R7 clk cmd dat0 dat1 dat2 dat3 Flip-Chip (16 Bumps) Table 1: Order Code Part Number EMIF06-HMC01F2 Marking GH Figure 1: Pin Configuration (ball side) 1 A B C D Table 2: Ball configuration A1 A2 A3 A4 B1 B2 B3 GND cmd clk Vmmc/Vdd MMCclk dat1 dat0 gnd MMCcmd C1 C2 C3 C4 D1 D2 D3 D4 dat2 gnd MMCdat1 MMCdat0 dat3 gnd MMCdat3 MMCdat2 B4 TM: IPAD is a trademark of STMicroelectronics. January 2005 REV. 1 1/7 .. Table 3: Absolute Maximum Ratings (Tamb = 25°C)) Symbol Parameter and test conditions Internal pins (A4, B4, C3, C4, D3, D4): ESD discharge IEC61000-4-2, air discharge ESD discharge IEC61000-4-2, contact discharge External pins (A1, A2, A3, B1, B2, C1, D1): ESD discharge IEC61000-4-2, air discharge ESD discharge IEC61000-4-2, contact discharge Maximum junction temperature Operating temperature range Storage temperature range Value 2 2 15 8 125 - 40 to + 85 - 55 to + 150 °C °C °C Unit VPP k V Tj Top Tstg Table 4: Electrical Characteristics (Tamb =...