EMIF06-mSD02C3 Datasheet | STMicroelectronics

Features - - - - - - - - - - EMI low-pass filter ESD protection ±15 k V (IEC 61000-4-2) Integrated pull up resistors to prevent bus floating when no card is connected 50 MHz clock frequency patibility with Cline < 20 p F Low power consumption Easy layout thanks to smart pin-out configuration Very low PCB space consuming High reliability offered by monolithic integration Flip Chip (16 bumps) Figure 1. Pin configuration (bump side) 4 3 2 1 Reduction of parasitic elements thanks to CSP integration Lead-free package B C D plies with the following standards: - IEC 61000-4-2 level 4 - 15 k V (air discharge) - 8 k V (contact discharge) MIL STD 883G - Method 3015-7 Class 3A SD Specification Part 1, Physical Layer Specification, Version 2.0 Description The EMIF06-m SD02C3 is a highly integrated device based on IPAD technology offering two functions: ESD protection to ply with IEC standard, and EMI filtering to reject mobile phone frequencies. - - Application Mini and micro (T-Flash) secure digital memory card in: - - Mobile phones munication systems TM: IPAD is a trademark of STMicroelectronics August 2010 Doc ID 16910 Rev 1 1/11 .st. 11 Characteristics EMIF06-m SD02C3 Characteristics Table 1. Symbol VPP Vin Tj Top Tstg Absolute ratings (limiting values) Parameter ESD discharge IEC 61000-4-2, air discharge ESD discharge IEC 61000-4-2, contact discharge Maximum input voltage Maximum junction temperature Operating temperature range Storage temperature range Value 15 15 5.5 125 - 40 to + 85 - 55 to + 150 Unit k V V °C °C...