Datasheet4U Logo Datasheet4U.com

HDMIULC6-4F3 - ultra-large bandwidth ESD protection

General Description

The HDMIULC6-4F3 is a monolithic, application specific discrete device dedicated to ESD protection of the HDMI connection.

It also offers the same high level of protection for IEEE 1394a and IEEE 1394b/c, USB 2.0, Ethernet links, and video lines.

TM: IPAD is a trademark of STMicroelectronics.

Key Features

  • 4-line 15 kV ESD protection Ultra low line capacitance (0.7 pF typ. ) Ultra-large bandwidth.
  • no influence on signal rise and fall times.
  • maximized number of signal harmonics Flow-through layout with Type C HDMI™ connector Low PCB space occupation - 1.76 mm² footprint Very low leakage current: 0.1 µA max. 0.4 mm pitch WLCSP package to minimize parasitic inductances RoHS compliant GND DOUT_1DIN_1-.
  • Flip Chip (top view) 10 bumps Fi.

📥 Download Datasheet

📁 Similar Datasheet

Part Number Description Manufacturer
HDMIULC6-4SC6Y Automotive ultralarge bandwidth ESD protection STMicroelectronics
HDMIULC6-2M6 Ultra Low Capacitance 2 line ESD protection STMicroelectronics
HDMIULC6-2P6 Ultra Low Capacitance 2 line ESD protection STMicroelectronics
HDMI2C1-14HD ESD protection and signal conditioning STMicroelectronics
HDMI2C1-14HDS ESD protection and signal conditioning STMicroelectronics

Other Datasheets by STMicroelectronics

Part Number Description
HDMIULC6-4SC6 Ultra large bandwidth ESD protection
HDMI05-CL02F3 control line ESD protection

Full PDF Text Transcription (Reference)

The following content is an automatically extracted verbatim text from the original manufacturer datasheet and is provided for reference purposes only.

View original datasheet text
HDMIULC6-4F3 www.datasheet4u.com 4-line IPAD™, ultra-large bandwidth ESD protection Features ■ ■ ■ 4-line 15 kV ESD protection Ultra low line capacitance (0.7 pF typ.) Ultra-large bandwidth – no influence on signal rise and fall times – maximized number of signal harmonics Flow-through layout with Type C HDMI™ connector Low PCB space occupation - 1.76 mm² footprint Very low leakage current: 0.1 µA max. 0.4 mm pitch WLCSP package to minimize parasitic inductances RoHS compliant GND DOUT_1DIN_1- ■ ■ ■ ■ ■ Flip Chip (top view) 10 bumps Figure 1.