HSP061-4NY8 Overview
HSP053-4M5 4-line ESD protection for high speed lines Datasheet - production data µQFN-5L package Very pact 500 µm pitch package, for easy PCB layout Ultra-large bandwidth: 18 GHz Ultra-low capacitance: 0.15 pF (I/O to I/O) and 0.25 pF (I/O to GND) Low leakage current: < 1 nA Extended operating junction temperature range: -40 °C to 150 °C Thin package: 0.4 mm max. RoHS pliant High ESD protection level High integration Suitable for high density boards plies with the following standards
HSP061-4NY8 Key Features
- Very pact 500 µm pitch package, for easy PCB layout
- Ultra-large bandwidth: 18 GHz
- Ultra-low capacitance: 0.15 pF (I/O to I/O)
- Low leakage current: < 1 nA
- Extended operating junction temperature
- Thin package: 0.4 mm max
- RoHS pliant
- High ESD protection level
- High integration
- Suitable for high density boards