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HSP061-4NY8 - 4-line ESD protection

Key Features

  • Very compact 500 µm pitch package, for easy PCB layout.
  • Ultra-large bandwidth: 18 GHz.
  • Ultra-low capacitance: 0.15 pF (I/O to I/O) and 0.25 pF (I/O to GND).
  • Low leakage current: < 1 nA.
  • Extended operating junction temperature range: -40 °C to 150 °C.
  • Thin package: 0.4 mm max.
  • RoHS compliant Benefits.
  • High ESD protection level.
  • High integration.
  • Suitable for high density boards Complies with the following standards.
  • MIL-STD 883G method 3015.

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HSP053-4M5 4-line ESD protection for high speed lines Datasheet - production data µQFN-5L package Features  Very compact 500 µm pitch package, for easy PCB layout  Ultra-large bandwidth: 18 GHz  Ultra-low capacitance: 0.15 pF (I/O to I/O) and 0.25 pF (I/O to GND)  Low leakage current: < 1 nA  Extended operating junction temperature range: -40 °C to 150 °C  Thin package: 0.4 mm max.