M30W0R6500T0 Description
LFBGA Connections (Top view through package) . 7 Address Inputs (A0-A21). 7 Data Input/Output (DQ0-DQ15).
M30W0R6500T0 Key Features
- MULTI-CHIP PACKAGE
- 1 die of 64 Mbit (4Mb x 16) Flash Memory
- 1 die of 32 Mbit (2Mb x 16) Flash Memory SUPPLY VOLTAGE
- VDDF1 = VDDF2 = VDDQ = 1.7 to 2.2V
- VPP = 12V for fast Program (optional) LOW POWER CONSUMPTION ELECTRONIC SIGNATURE
- Manufacturer Code: 20h
- 64Mb Device Code (Top Configuration): 8810h
- 32Mb Device Code (Top Configuration): 8814h PACKAGE
- pliant with Lead-Free Soldering Processes
- Lead-Free Versions