M30W0R6500T0
M30W0R6500T0 is Multi-Chip Package manufactured by STMicroelectronics.
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96 Mbit (64 + 32Mb, x16, Multiple Bank, Burst, Flash Memories) 1.8V Supply, Multi-Chip Package
Features
SUMMARY
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- MULTI-CHIP PACKAGE
- 1 die of 64 Mbit (4Mb x 16) Flash Memory
- 1 die of 32 Mbit (2Mb x 16) Flash Memory SUPPLY VOLTAGE
- VDDF1 = VDDF2 = VDDQ = 1.7 to 2.2V
- VPP = 12V for fast Program (optional) LOW POWER CONSUMPTION ELECTRONIC SIGNATURE
- Manufacturer Code: 20h
- 64Mb Device Code (Top Configuration): 8810h
- 32Mb Device Code (Top Configuration): 8814h PACKAGE
- pliant with Lead-Free Soldering Processes
- Lead-Free Versions
Figure 1. Packages
FBGA
Stacked LFBGA88 (ZA) 8 x 10mm
FLASH MEMORY
- SYNCHRONOUS / ASYNCHRONOUS READ
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