M30W0R6500T0 - Multi-Chip Package

STMicroelectronics

General Description

Datasheet Details

Part number	M30W0R6500T0
Manufacturer	STMicroelectronics
File Size	323.69 KB
Description	Multi-Chip Package
Datasheet	M30W0R6500T0 Datasheet

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www.DataSheet4U.com M30W0R6500T0 96 Mbit (64 + 32Mb, x16, Multiple Bank, Burst, Flash Memories) 1.8V Supply, Multi-Chip Package FEATURES SUMMARY ■ ■ ■ ■ ■ MULTI-CHIP PACKAGE – 1 die of 64 Mbit (4Mb x 16) Flash Memory – 1 die of 32 Mbit (2Mb x 16) Flash Memory SUPPLY VOLTAGE – VDDF1 = VDDF2 = VDDQ = 1.7 to 2.2V – VPP = 12V for fast Program (optional) LOW POWER CONSUMPTION ELECTRONIC SIGNATURE – Manufacturer Code: 20h – 64Mb Device Code (Top Configuration): 8810h – 32Mb Device Code (Top Configuration): 8814h PACKAGE – Compliant with Lead-Free Soldering Processes – Lead-Free Versions Figure 1.