PLCC20 Description
® Thermal Data PLCC 20 20 leads PACKAGE MATERIAL LIST item # material thickness thermal conductivity 2.61 W/cm°C 0.01 W/cm°C leadframe die attach copper epoxy glue ( silver filler ) epoxy resin 0.25 mm 10-40 µm molding pound 3.6 mm 0.0063W/cm°C Charts enclosed.