SO14 Overview
® Thermal Data SO 14 14 leads PACKAGE MATERIAL LIST item # material thickness thermal conductivity 2.61 W/cm°C 0.01 W/cm°C leadframe die attach copper epoxy glue ( silver filler ) epoxy resin 0.20 mm 10-40 µm molding pound 1.65 mm 0.0063W/cm°C Charts enclosed.
