Download STP16CP596 Datasheet PDF
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STP16CP596 Description

Under these conditions, functional operation is not implied. Thermal Data Symbol Parameter DIP-24 60 SO-24 75 TSSOP24 85 TSSOP24 ( ) (exposed pad) 37.5 Unit °C/W Rthj-amb Junction-ambient ( ) The exposed pad should be soldered directly to the PCB to realize the thermal benefits.