• Part: CX9
  • Description: Ultra Miniature Surface Mount AT Quartz Crystal
  • Manufacturer: STATEK
  • Size: 249.83 KB
Download CX9 Datasheet PDF
STATEK
CX9
CX9 is Ultra Miniature Surface Mount AT Quartz Crystal manufactured by STATEK.
DESCRIPTION Designed and manufactured in the USA, the CX9 family of medical RF telemetry crystals provide the widest frequency range for this application. Using micro-machining processes, this surface mount crystal is hermetically sealed within an ultra miniature ceramic package to ensure high stability and low aging. Small size, tight calibration and excellent frequency/temperature stability make the CX9 telemetry crystal ideally suited for medical applications. FEATURES ceramic lid DIMENSIONS Low profile (less than 1 mm) Ultra-miniature, surface mount design Hermetically sealed ceramic package Excellent aging characteristics Designed and manufactured in the USA B APPLICATIONS BOTTOM TYPICAL MAXIMUM inches 0.170 0.068 0.038 mm 4.32 1.73 0.97 Medical RF Telemetry Pacemakers Defibrillators Neurostimulators Infusion Pumps Glucose Monitors DIM A B C D inches 0.160 0.060 0.031 mm 4.10 1.50 0.79 see below SUGGESTED LAND PATTERN THICKNESS (DIM C) MAXIMUM CERAMIC LID TERMINATION SM1 SM2/SM4 SM3/SM5 inches 0.035 0.035 0.037 mm 0.90 0.90 0.94 GLASS LID inches 0.034 0.034 0.036 mm 0.87 0.87 0.91 inches (mm) 10187 Rev B STATEK CORPORATION 512 N. MAIN ST., ORANGE, CA 92868 714-639-7810 FAX: 714-997-1256 .statek. http://.. SPECIFICATIONS TERMINATIONS Specifications are typical at 25OC unless otherwise noted. Specifications are subject to change without notice. Fundamental Frequency 14.7456 MHz 24.0 MHz 26.5 MHz Motional Resistance R1(Ω) 80 30 30 Motional Capacitance C1 (f F) Quality Factor Q (k) Shunt Capacitance C0 (p F) Calibration Tolerance1 Load Capacitance Drive Level Frequency-T emperature Stability1,2 Aging, first year3 Shock, survival Vibration, survival 1.2 115 0.6 1.6 150 0.8 1.8 100 0.8 Designation SM1 SM2 SM3 SM4 SM5 Termination Gold Plated (Lead Free) Solder Plated Solder Dipped Solder Plated (Lead Free) Solder Dipped (Lead Free) Max Process Temperature 260OC for 20 sec. ±40 ppm, or tighter as required 10 p F (unlessspecifiedot...