STATS ChipPAC QFP-EP
The STATS ChipPAC logo is a registered trademark of STATS ChipPAC Ltd.| Part No. | QFP-EP |
|---|---|
| Datasheet | QFP-EP Download |
| Manufacturer | STATS ChipPAC |
| Description | Exposed Pad Quad Flat Pack |
| Buy | Stock & Price |
FEATURES
● Body Sizes: 7 x 7mm to 24 x 24mm● Package Height: 1.0mm (TQFP-ep) and 1.4mm (LQFP-ep)
● Lead Counts: 32L to 216L
● Lead Pitch: 0.40mm to 0.80mm
● Wide range of open tool leadframe and die pad sizes available
● JEDEC standard compliant
● Lead-free and Green material sets available
DESCRIPTION
STATS ChipPAC’s Exposed Pad Quad Flat Pack (QFP-ep) is a thermally enhanced version of the QFP package. Thermal enhancement is achieved by means of an exposed die pad, which can be soldered to a mother PC board for effective heat removal and grounding. STATS ChipPAC’s QFP-ep family includes the Exposed Pad-Low Profile QFP (LQFP-ep) and the Exposed Pad-Thin QFP (TQFP-ep). These enhanced thermal packages are made possible by deep downset die pad leadframe design combined with well controlled low loop wirebonding and package warpage control during the molding process.APPLICATIONS
● ASIC● DSP
● Gate Array
● Logic, Microprocessors/Controllers
● Multimedia, PC Chipsets, Others DataSheet 4 U...
