• Part: QFP-EP
  • Manufacturer: STATS ChipPAC
  • Size: 238.22 KB
Download QFP-EP Datasheet PDF
QFP-EP datasheet preview
QFP-EP page 2
Page 2

QFP-EP Key Features

  • Body Sizes: 7 x 7mm to 24 x 24mm
  • Package Height: 1.0mm (TQFP-ep) and 1.4mm (LQFP-ep)
  • Lead Counts: 32L to 216L
  • Lead Pitch: 0.40mm to 0.80mm
  • Wide range of open tool leadframe and die pad sizes available
  • JEDEC standard pliant
  • Lead-free and Green material sets available

Other QFP-EP Datasheets

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iSYSTEM
iSYSTEM		 QFP44 POD Target Layout
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iSYSTEM		 QFP44 TET
Rohm Logo ROHM QFP44 LSI Assembly

QFP-EP Description

STATS ChipPAC’s Exposed Pad Quad Flat Pack (QFP-ep) is a thermally enhanced version of the QFP package. Thermal enhancement is achieved by means of an exposed die pad, which can be soldered to a mother PC board for effective heat removal and grounding. STATS ChipPAC’s QFP-ep family includes the Exposed Pad-Low Profile QFP (LQFP-ep) and the Exposed Pad-Thin QFP (TQFP-ep).