QFP-EP Overview
STATS ChipPAC’s Exposed Pad Quad Flat Pack (QFP-ep) is a thermally enhanced version of the QFP package. Thermal enhancement is achieved by means of an exposed die pad, which can be soldered to a mother PC board for effective heat removal and grounding. STATS ChipPAC’s QFP-ep family includes the Exposed Pad-Low Profile QFP (LQFP-ep) and the Exposed Pad-Thin QFP (TQFP-ep).
QFP-EP Key Features
- Body Sizes: 7 x 7mm to 24 x 24mm
- Package Height: 1.0mm (TQFP-ep) and 1.4mm (LQFP-ep)
- Lead Counts: 32L to 216L
- Lead Pitch: 0.40mm to 0.80mm
- Wide range of open tool leadframe and die pad sizes available
- JEDEC standard pliant
- Lead-free and Green material sets available
