QFP-SD Datasheet Stacked Die Quad Flat Pack

Manufacturer: STATS ChipPAC

Datasheet Details

STATS ChipPAC’s Stacked Die QFP offering includes LQFPSD, LQFP-ep-SD and TQFP-ep-SD.

LQFP-SD is a stacked die low profile QFP.

LQFP-ep-SD is an exposed pad version that provides enhanced thermal performance.

www.DataSheet4U.com QFP-SD Stacked Die Quad Flat Pack • Stacking of die enables more functionality and integration in a conventional QFP.

Combining devices into one package reduces PCB real estate and cost.
Increased sub-system performance by integrating multiple chips into a single package.
Die to die bonding capability for device/signal integration.
Standard and green/lead-free materials and Pb-free plating.
Options for mixed technologies, 2 or more stacked dice.
Fine pitch bonding capability.
Exposed pad provides enhanced thermal performance.
Low profile p.

Brand Logo	Part Number	Description	Manufacturer
	QFP-A64	LSI Assembly	Rohm
	QFP-T80	LSI Assembly	Rohm
iSYSTEM	QFP44	POD Target Layout	iSYSTEM
iSYSTEM	QFP44	TET	iSYSTEM
	QFP44	LSI Assembly	Rohm

Part Number	Description
QFP-EP	Exposed Pad Quad Flat Pack