QFP-SD Key Features
- bining devices into one package reduces PCB real estate and cost
- Increased sub-system performance by integrating multiple chips into a single package
- Die to die bonding capability for device/signal integration
- Standard and green/lead-free materials and Pb-free plating
- Options for mixed technologies, 2 or more stacked dice
- Fine pitch bonding capability
- Exposed pad provides enhanced thermal performance
- Low profile package thickness of 1.40mm (LQFP-SD and LQFP-ep-SD); 1.00mm (TQFP-ep-SD)
- Lead pitch ranges from 0.80mm to 0.40mm
- Pin count ranges from 32 to 208 leads (LQFP-SD), 64 to 216 leads (LQFP-ep-SD), 32 to 100 leads (TQFP-ep-SD)
