STATS ChipPAC QFP-SD
The die to die wire bonding capability enables device/signal integration to improve electrical performance and reduce overall package I/O requirements.| Part No. | QFP-SD |
|---|---|
| Datasheet | QFP-SD Download |
| Manufacturer | STATS ChipPAC |
| Description | Stacked Die Quad Flat Pack |
| Buy | Stock & Price |
FEATURES
● Combining devices into one package reduces PCB real estate and cost● Increased sub-system performance by integrating multiple chips into a single package
● Die to die bonding capability for device/signal integration
● Standard and green/lead-free materials and Pb-free plating
● Options for mixed technologies, 2 or more stacked dice
● Fine pitch bonding capability
● Exposed pad provides enhanced thermal performance
● Low profile package thickness of 1.40mm (LQFP-SD and LQFP-ep-SD); 1.00mm (TQFP-ep-SD)
● Lead pitch ranges from 0.80mm to 0.40mm
● Pin count ranges from 32 to 208 leads (LQFP-SD), 64 to 216 leads (LQFP-ep-SD), 32 to 100 leads (TQFP-ep-SD)
● JEDEC standard compliant package outlines
DESCRIPTION
STATS ChipPAC’s Stacked Die QFP offering includes LQFPSD, LQFP-ep-SD and TQFP-ep-SD. LQFP-SD is a stacked die low profile QFP. LQFP-ep-SD is an exposed pad version that provides enhanced thermal performance. TQFP-ep-SD is a thin profile exposed pad version with enhanced thermal performance.