TSSOP Overview
STATS ChipPAC offers a plete line of Small Outline Package (SOP) families including TSSOP, TSSOP-ep, and MSOP. STATS ChipPAC’s TSSOP (Thin Shrink Small Outline Package) is suitable for applications requiring a thin profile. TSSOP is a leadframe based, plastic encapsulated package with gull wing shaped leads on two sides with lead count ranging from 8 to 56 leads.
TSSOP Key Features
- Body Size: 3.0 x 4.4mm to 14.0 x 6.1mm
- Lead Count: 8L to 56L
- Lead Pitch: 0.50mm & 0.65mm
- Package Height: 1.20mm max
- JEDEC standard pliant (MO-153)
- Lead-free (Pb-free) and Green
- Thermal Enhancements: ep (exposed pad) MSOP
- Body Size: 3 x 3mm
- Lead Count: 8L & 10L
- Lead Pitch: 0.65mm (8L) and 0.50mm (10L)
