STATS ChipPAC TSSOP
TSSOP is a leadframe based, plastic encapsulated package with gull wing shaped leads on two sides with lead count ranging from 8 to 56 leads. The ultra thin TSSOP is made possible by optimal wire looping control during the wire bonding process as well as optimal package warpage control during the molding process. TSSOP is designed to fill the niche of low pin count devices where low profile and small footprint are key design considerations.| Part No. | TSSOP |
|---|---|
| Datasheet | TSSOP Download |
| Manufacturer | STATS ChipPAC |
| Description | Small Outline Packages |
| Buy | Stock & Price |
FEATURES
TSSOP● Body Size: 3.0 x 4.4mm to 14.0 x 6.1mm
● Lead Count: 8L to 56L
● Lead Pitch: 0.50mm & 0.65mm
● Package Height: 1.20mm max.
● JEDEC standard compliant (MO-153)
● Lead-free (Pb-free) and Green
● Thermal Enhancements: ep (exposed pad) MSOP
● Body Size: 3 x 3mm
● Lead Count: 8L & 10L
● Lead Pitch: 0.65mm (8L) and 0.50mm (10L)
● JEDEC standard compliant
● Lead-free (Pb-free) and Green
● Thermal enhancements: ep (exposed pad)
DESCRIPTION
STATS ChipPAC offers a complete line of Small Outline Package (SOP) families including TSSOP, TSSOP-ep, and MSOP. STATS ChipPAC’s TSSOP (Thin Shrink Small Outline Package) is suitable for applications requiring a thin profile. The TSSOP features 0.5 and 0.65mm lead pitch, and is ideal for low pin count analog and mixed signal devices in handheld applications such as PDAs and mobile / cellular phones. Taking the reliability of Small Outline Packages (SOP) one step further, STATS ChipPAC offers a Micro Small Outline Package (MSOP) for applications requiring thin, small, and high reliability.