STMicroelectronics A1P35S12M3
This power module is a sixpack topology in an ACEPACK™ 1 package with NTC, integrating the advanced trench gate field-stop technologies from STMicroelectronics. This new IGBT technology represents the best compromise between conduction and switching loss, to maximize the efficiency of any converter system up to 20 kHz.FEATURES
● ACEPACK™ 1 power module – DBC Cu Al2O3 Cu● Sixpack topology – 1200 V, 35 A IGBTs and diodes – Soft and fast recovery diode
● Integrated NTC
APPLICATIONS
● Inverters● Industrial
● Motor drives
DESCRIPTION
Product status A1P35S12M3 Product summary Order code A1P35S12M3 Marking A1P35S12M3 Package ACEPACK™ 1 Leads type Solder contact pins DS11635 - Rev 5 - November 2018 For further information contact your local STMicroelectronics sales office. 1 Electrical ratings A1P35S1