STMicroelectronics A2P75S12M3-F
This power module is a sixpack topology in an ACEPACK™ 2 package with NTC, integrating the advanced trench gate field-stop technologies from STMicroelectronics. This new IGBT technology represents the best compromise between conduction and switching loss, to maximize the efficiency of any converter system up to 20 kHz.FEATURES
● ACEPACK™ 2 power module – DBC Cu Al2O3 Cu● Sixpack topology – 1200 V, 75 A IGBTs and diodes – Soft and fast recovery diode
● Integrated NTC
APPLICATIONS
● Inverters● Industrial
● Motor drives
DESCRIPTION
Product status A2P75S12M3-F Product summary Order code A2P75S12M3-F Marking A2P75S12M3-F Package ACEPACK™ 2 Leads type Press fit contact pins DS11656 - Rev 5 - January 2019 For further information contact your local STMicroelectronics sales office. 1 Electrical ratings A2P7