A2U12M12W2-F1C Overview
Description
OUT NEUT This ACEPACK 2 power module represents a leg of a T-type 3-level inverter topology that integrates the advanced silicon carbide power MOSFET technology from STMicroelectronics. This module is manufactured using both the innovative properties of the wide bandgap materials and the high thermal performance substrate, which results in exceptional low on-resistance per unit area and excellent DC- GADG280120201229SA switching performance almost independent of temperature.
