STMicroelectronics A2U12M12W2-F1C
This ACEPACK 2 power module represents a leg of a T-type 3-level inverter topology that integrates the advanced silicon carbide power MOSFET technology from STMicroelectronics. This module is manufactured using both the innovative properties of the wide bandgap materials and the high thermal performance substrate, which results in exceptional low on-resistance per unit area and excellent DC- GADG280120201229SA switching performance almost independent of temperature.| Part No. | A2U12M12W2-F1C |
|---|---|
| Datasheet | A2U12M12W2-F1C Download |
| Manufacturer |  STMicroelectronics |
| Description | ACEPACK 2 power module |
| Buy | Stock & Price |
FEATURES
● ACEPACK 2 power module – 13 mΩ of typical RDS(on) each switch (2 dice in parallel per switch) – 2.5 kVrms insulation voltage – Integrated NTC temperature sensor – DC link capacitors between DC BUS and neutral – AIN DBC improved thermal performance – Press fit contact pinsAPPLICATIONS
● High frequency convertersDESCRIPTION
OUT NEUT A negative temperature sensor and three DC link capacitors are also included to optimize switching behavior. Product status link A2U12M12W2-F1C Product summary Order code A2U12M12W2-F1C Marking A2U12M12W2-F1C Package ACEPACK 2 Leads type Press fit Packing Tray DS13800 - Rev 1 - September 2021 For further information contact your local STMicroelectronics sales office. 1 Electrical ratings A2U12M12W2-F1C Electrical ratings 1.1 Inverter switch (Every switch is made by two SiC MOSFET in parallel and their gates are shorted during every single test, TJ = 25 °C unless otherwise specified). Table 1. Absolute maximum ratings Symbol Parameter VDS Drain so...
