DESCRIPTION
For a better understanding of the device and it’s working principle, a short description of the main building blocks is given here below, with packaging options and complete block diagram. Figure 1. Two packaging options, with the pin function assignements. OSC OUT OUT GND GND GND VCC VCC BOOT 1 2 3 4 5 6 7 8 9 D94IN162A 18 17 16 15 14 13 12 11 10 SYNC SS V5.1 GND GND GND VFB COMP INH OSC OUT OUT GND GND GND GND VCC VCC BOOT 1 2 3 4 5 6 7 8 9 10 D94IN163A 20 19 18 17 16 15 14 13 12 11 SYNC SS V5.1 GND GND GND GND VFB COMP INH POWERDIP (12+3+3) SO20 (12+4+4) Figure 2. Device block diagram. VCC INH 10(11) et4U.com DataSheet4U.com 16(18) VREF GOOD V5.1 VCC 7(8) VCC 8(9) CBOOT CHARGE DataShe e ZERO CURRENT INHIBIT 5.1V 3.3V INTERNAL REFERENCE INTERNAL SUPPLY 5.1V CSS SS 17(19) SOFT START HICCUP CURRENT LIMITING COMP 11(12) THERMAL SHUTDOWN 5.1V 3.3V 12(13) + E/A CURRENT LIMITING BOOT R S Q Q 9(10) VFB + PWM SYNC R OSC V CC COSC OSC 18(20) OSCILLATOR 1(1) 4,5,6,13,14,15 (4,5,6,7,14,15,16,17) GND D97IN683 DRIVER 3(3) OUT 2(2) OUT VO Pin x = Powerdip Pin (x) = S020 POWER SUPPLY, UVLO and VOLTAGE REFERENCE.
STMicroelectronics
