STMicroelectronics BALF-NRF01D3
BALF-NRF01D3 is an ultraminiature balun. The BALF-NRF01D3 integrates matching network in a monolithic glass substrate. The BALF-NRF01D3 uses STMicroelectronics IPD technology on non-conductive glass substrate which optimize RF performance.FEATURES
● Low insertion loss● Low amplitude imbalance
● Low phase imbalance
● Coated Flip-Chip on Glass
● Small footprint: < 1.5 mm2 Benefits
● Very low profile: < 560 µm after reflow
● High RF performance
● PCB space saving versus discrete solution
● BOM count reduction
● Efficient manufacturability
DESCRIPTION
STMicroelectronics BALF-NRF01D3 is an ultraminiature balun. Matching impedance has been customized for the nRF51822-QFAA/QFAB, and nRF51422-QFAA/QFAB RF transceivers. Figure 1. Pinout diagram (top view) 3 21 DIFF DIFF GND VCC A SE B CAPPLICATIONS
● 2.45 GHz balun with integrated matching network● Matching optimized for following chipsets: nRF51822-QFAA/QFAB, and nRF51422QFAA/QFAB July 2015 This is information on a product in full production. DocID026031 Rev 4 1/11 11 Characteristics 1 Characteristics BALF-NRF01D3 Table 1. Absolute maximum ratings (limiting values) Symbol Parameter Value Unit Min. Typ. Max. PIN VESD TOP Input Power RFIN ESD ratings MIL STD883C (HBM: C = 100...