FEATURES AND BENEFITS
COMPACT ISOTOP DESIGN COMPATIBLE WITH FAST DIODES AND TRANSISTORS. EXCELLENT THERMAL TRANSFER BETWEEN JUNCTION AND HEATSINK UL PENDING DESCRIPTION
Single phase and 3-phase high power SMPS, UPS, MOTOR DRIVES and WELDING equipment will primarily find advantage in these industry package products. 35 A 1000 V 150 °C 1.30 V + + - ISOTOPTM ABSOLUTE RATINGS AND ELECTRICAL CHARACTERISTICS
(per diode unless specified) Symbol VRRM VRSM IF(AV) total IFSM I2.t Tstg Tj Pmax total Parameter Repetitive peak reverse voltage Non repetitive peak reverse voltage Average forward current Tc = 80°C sinusoidal Surge non repetitive forward current 50Hz JEDEC method Fusing Storage temperature range Maximum operating junction temperature Totol power dissipation Value 1000 1000 35 300 660 - 55 to + 150 150 50 Unit V V A A A2.s °C °C W TM : ISOTOP is a trademark of ST Microelectronics. August 1999 - Ed: 2A 1/3 BF3510TV THERMAL RESISTANCES Symbol Rth (j-c) Junction to case Parameter total Val...
STMicroelectronics
