DIP24 datasheet by STMicroelectronics.
| Part number | DIP24 |
|---|---|
| Datasheet | DIP24_STMicroelectronics.pdf |
| File Size | 31.53 KB |
| Manufacturer | STMicroelectronics |
| Description | Thermal Data |
|
|
® Thermal Data DIP 24 24 leads PACKAGE MATERIAL LIST item # material thickness thermal conductivity 2.61 W/cm°C 0.01 W/cm°C leadframe die attach copper epoxy glue ( silver filler ) epoxy resin 0.25 mm 10-40 µm molding pound 3 mm 0.0063W/cm°C Charts enclosed.
View DIP24-1A72-11 datasheet index
| Brand Logo | Part Number | Description | Other Manufacturers |
|---|---|---|---|
 |
DIP24-1A72-11 | (DIP Series) Molded DIP Reed Relays | MEDER |
|
DIP24-1Axx-xx | (DIP Series) Molded DIP Reed Relays | MEDER |
|
DIP24-1Bxx-xx | (DIP Series) Molded DIP Reed Relays | MEDER |
|
DIP24-2Axx-xx | (DIP Series) Molded DIP Reed Relays | MEDER |
View all STMicroelectronics datasheets
| Part Number | Description |
|---|---|
| DIP40 | Thermal Data |
