DIP24 - Thermal Data

STMicroelectronics

Datasheet Details

Part number	DIP24
Manufacturer	STMicroelectronics
File Size	31.53 KB
Description	Thermal Data
Datasheet	DIP24 Datasheet
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DIP40 - Thermal Data

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® Thermal Data DIP 24 24 leads PACKAGE MATERIAL LIST item # material thickness thermal conductivity 2.61 W/cm°C 0.01 W/cm°C leadframe die attach copper epoxy glue ( silver filler ) epoxy resin 0.25 mm 10-40 µm molding compound 3 mm 0.0063W/cm°C Charts enclosed : 1) Rth(j-a) vs power dissipation 2) Zth(j-a) vs time width and die size February 1998 1/2 Thermal Data DIP 24 Rth(j-a) (ºC/W) 85 copper frame thickness = 0.25 mm die pad = 150 x 280 sq.mils die size = 10.000 sq.mils 1) 80 75 70 floating in air 65 60 mounted on board 55 0 0.2 0.4 0.6 0.8 1 1.2 1.4 1.6 1.8 dissipated power ( Watt ) 2 2.2 2.4 2.6 2.8 3 Transient Thermal Resistance (ºC/W) 100 copper frame thickness = 0.25 mm die pad = 110 x 280 sq.mils 50 30 20 2) 10 on die dissipating area = 2000 sq.

Published: Jun 3, 2005 |