STMicroelectronics EMIF02-SPK02F2
The EMIF02-SPK02F2 chip is a highly integrated device designed to suppress EMI/RFI noise for interface line filtering. The EMIF02-SPK02F2 flip-chip packaging means the package size is equal to the die size. That's why the EMIF02-SPK02F2 is a very small device.| Part No. | EMIF02-SPK02F2 |
|---|---|
| Datasheet | EMIF02-SPK02F2 Download |
| Manufacturer |  STMicroelectronics |
| Description | EMI filter and ESD protection |
| Buy | Stock & Price |
FEATURES
● Packaged in lead-free Flip Chip● Very low resistance: 0.35 Ω
● High attenuation: -45 dB at 900 MHz
● Very low PCB space consumption: 0.89 mm x 1.26 mm
● Very thin package: 0.65 mm
● High efficiency in ESD suppression IEC6 1000-4-2 level 4
● High reliability offered by monolithic integration
● High reduction of parasitic elements through integration and wafer level packaging Complies with the following standards
● IEC 61000-4-2 level 4: – ±15 kV (air discharge) – ±8 kV (contact discharge) Application
● Mobile phones
DESCRIPTION
Additionally, this filter includes ESD protection circuitry, which prevents damage to the protected device when subjected to ESD surges up 30 kV. Datasheet − production data Flip-Chip package (5 bumps) Figure 1. Pin configuration (bump side) 321 O1 I1 A GND B O2 I2 C Figure 2. Functional schematic Input Output April 2012 This is information on a product in full production. TM: IPAD is a trademark of STMicroelectronics Doc ID 15035 Rev 3 1/12 12 Characteristics 1 Characteristics EMIF02-SPK02F2 Table 1.
