STMicroelectronics EMIF02-USB02F2
The EMIF02-USB02F2 is a highly integrated array designed to suppress EMI / RFI noise for a USB port. The EMIF02-USB02F2 Flip Chip packaging means the package size is equal to the die size.FEATURES
●●
●
●
●
●
●
● 2-line low-pass filter + ESD protection High efficiency in EMI filtering Lead-free package Very low PCB space occupation < 3.2 mm2 Very thin package: 0.65 mm High efficiency in ESD suppression High reliability offered by monolithic integration High reduction of parasitic elements through integration and wafer level packaging Figure 1. Pin layout (bump side) 4 3 VCC Flip Chip (10 bumps) 2 1 I6 A B Complies with the following standards:
● I4 O2 I3 O1 I5 I2 GND I1 IEC 61000-4-2 – 15 kV (air discharge) – 8 kV (contact discharge) MIL STD 883E - Method 3015-6 Class 3 Figure 2. I6 I5 I4 D1 C D E
● Application EMI filtering and ESD protection for USB port. Basic cell configuration VCC R3 1.3kΩ R2 33Ω I2 O2
DESCRIPTION
Additionally, this filter includes ESD protection circuitry which prevents damage to the application when subjected to ESD surges up to 15 kV. R4 10kΩ I3 25pF 25pF GND 25pF 25pF I1 R1 33Ω O1 GND April 2008 Rev 2 1/7 7 Characteristics EMIF02-USB02F2 1 Characteristics Table 1.