EMIF02-USB02F2 Overview
Key Specifications
Package: FCBGA
Height: 650 µm
Length: 1.97 mm
Width: 1.62 mm
Description
The EMIF02-USB02F2 is a highly integrated array designed to suppress EMI / RFI noise for a USB port. The EMIF02-USB02F2 Flip Chip packaging means the package size is equal to the die size.
Key Features
- Pin layout (bump side) 4 3 VCC Flip Chip (10 bumps) 2 1 I6 A B Complies with the following standards
- Method 3015-6 Class 3 Figure
