STMicroelectronics EMIF03-SIM01F2
The EMIF03-SIM01F2 is a highly integrated devices designed to suppress EMI/RFI noise in all systems subjected to electromagnetic interferences. The EMIF03 flip chip packaging means the package size is equal to the die size. This filter includes an ESD protection circuitry which prevents the device from destruction when subjected to ESD surges up 15kV.APPLICATIONS
: EMI filtering and ESD protection for:● SIM Interface (Subscriber Identify Module)
● UIM Interface (Universal Identify Module)
DESCRIPTION
Flip-Chip (8 Bumps) BENEFITS Table 1: Order Code● EMI symmetrical (I/O) low-pass filter Part Number Marking
● High efficiency in EMI filtering EMIF03-SIM01F2 FC
● Lead free package
● Very low PCB space consuming: Figure 1: Pin Configuration (Ball side) 1.42mm x 1.42mm
● Very thin package: 0.65 mm DataSheet4U.com
● High efficiency in ESD suppression 3 2 1
● High reliability offered by monolithic integration
● High reducing of parasitic elements through RST RST A out in integration & wafer level packaging. COMPLIES WITH THE FOLLOWING STANDARDS: IEC61000-4-2 Level 4 15kV (air discharge) 8kV (contact discharge) MIL STD 883E - Method 3015-6 Class 3 CLT in Gnd CLT out DataShee B C Data in VCC Data out Figure 2: Configuration VCC 100 Ω RST in R1 47 Ω CLK in R2 100 Ω Data in R3 Data out CLK out RST out Cline = 35pF max. GND TM: IPAD is a trademark of STMicroelectronics.